IRM
Micron Size
IRM
[Uses]Dicing blade, Back grinder, Polishing sheet, Polishing film
A representative product of Tomei Diamond. The abrasive grains with irregular shape are widely used for "cutting", "grinding", and "polishing" in the processing of difficult-to-process materials.
Available sizes
IMM-H
Micron Size
IMM-H
[Uses]Dicing Blade, Metal Bond Grinding Wheel
Abrasive grains that are used for "cutting" and "grinding" of difficult-to-process materials by utilizing high hardness in irregular shapes.
vailable sizes
IRM-F
Micron Size
IRM-F
[Uses]Dicing blades, Notch wheels
The IRM-F is a more precisely classified version of the IRM. Excellent performance in precision grinding process in the semiconductor field.
vailable sizes
IRM-NP
Micron Size
IRM-NP
[Uses] Resin bond grinding wheels, Resin bond polishing wheels
IMM-H coated with nickel metal (30wt%, 55wt%), suitable for wet processing wheels for semiconductors and electronic components.
vailable sizes
IRM-CPS
Micron Size
IRM-CPS
[Uses]Dry polishing wheels
IRM coated with copper metal (50wt%) suitable for dry polishing wheels for semiconductors and electronic components.
vailable sizes
IMM-HNP
Micron Size
IMM-HNP
[Uses]Diamond wire saws
High strength, angular shape, nickel coating, and abrasive grains that meet the requirements of diamond wire saws.
vailable sizes
TED-MⅡ
Micron Size
TED-MⅡ
[Uses]Polishing tools for electronic components
Micron size diamond abrasive suitable for electroplated tools that require processing surface roughness.
vailable sizes
IMM-HE
Micron Size
IMM-HE
[Uses]Chamfering tools for electronic parts
Micron size diamond abrasive for electroplated tools with hardness higher than TED-MⅡ.
vailable sizes
MD
Nano Size
MD
[Uses]Back grinder
Miracle Diamond is a nano-sized abrasive grain that enables precision grinding and polishing of silicon and other materials.
vailable sizes
PM
Nano Size
PM
[Uses]Chamfering tools for electronic components
MD with special treatment suitable for delicate polishing of composite materials such as magnetic heads.
vailable sizes
TMS
Mesh Size
TMS
[Uses]Diamond Cutter
Abrasive grains suitable for tough applications such as stone and civil engineering cutters and band saws.
vailable sizes
TMD-PDB
Polycrystalline diamond substrate
TMD-PDB
[Uses]Heat sinks, wear-resistant parts
100% carbon polycrystalline diamond without binder synthesized by CVD method. It is used in applications where a large area is required.
Available sizes
TMD-PDH
Polycrystalline diamond substrate
TMD-PDH
[Uses]Heat sinks, wear-resistant parts
100% carbon polycrystalline diamond without any binder synthesized by CVD method. It is used for high value-added applications that pursue the characteristic points of diamond such as thermal conductivity.
Available sizes
TMD-Ib
単結晶ダイヤモンド基板
TMD-Ib
[Uses]Aspheric processing tools, cutting and finishing tools, record needles
TMD-Ib is a product made from Ib-type single crystal diamond synthesized by the CVD method and cut to desired dimensions. It is possible to produce tools with cutting edges of nano-level surface roughness.
Available sizes
New approaches
We create business from scratch, such as ozone water generation using diamond electrodes.
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